Phase Equilibria of the Sn-Ag-Cu-Ni Quaternary System at 210°C-Reference-Cited by-同舟云学术

Phase Equilibria of the Sn-Ag-Cu-Ni Quaternary System at 210°C

Published:2007-04-10 Issue:3 Volume:36 Page:197-206
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Chen S.-W.,Chiu C.-N.,Hsieh K.-C.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-007-0093-9.pdf

Reference21 articles.

1. R.J. Klein Wassink, Soldering in Electronics, 2nd ed. (British Isles, England: Electrochemical Publication Limited, 1989) pp. 135–203

2. L.J. Turbini, G.C. Munie, D. Bernier, J. Gamalski, D.W. Bergman, IEEE Trans. Electron. Packag. Manufact. 24, 4 (2001)

3. Off . J. Europ. Union, p. L37/19 (2003)

4. “Lead-Free Assembly Projects,” NEMI (National Electronics Manufacturing Initiatives, 1999), http://www.nemi.org/projects/ese/lf_assembly.html

5. “Roadmap 2002 for Commercialization of Lead-Free Solder,” Lead-Free Soldering Roadmap Committee, Technical Standardization Committee on Electronics Assembly Technology, JEITA (Japan Electronics and Information Technology Industries Association, 2002), pp. 143–171

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