1. U. R. Kattner, Phase Diagrams for Lead-Free Solder Alloys, Journal of Materials, December, Vol. 54, pp.45-51, 2002.
2. J.Y. Park, C.U Kim, T. Carper, and V. Puligandla, Phase Equilibria Studies of Sn-Ag-Cu Eutectic Solder Using Differential Cooling of Sn-3.8Ag-0.7Cu Alloys, Journal of Electronic Materials, Vol. 32, No. 11, pp.1297-1302, 2003.
3. X.J. Liu, C.P. Wang, F. Gao, I. Ohnuma, and K. Ishida, Thermodynamic Calculation of Phase Equilibria in the Sn-Ag-Cu-Ni-Au System”, Journal of Electronic Materials, Vol. 36, No. 11, pp.1429-1441, 2007.
4. K.W. Moon, W.J. Boettinger, U.R. Kattner, F.S. Biancaniello, C.A. Handwerker, Experimental and Thermodynamic Assessment of Sn-Ag-Cu Solder Alloys, Journal of Electronic Materials, Vol.29, No.10, pp.1122-1136, 2000.
5. S.W. Chen and C.A. Chang, Phase Equilibria of the Sn-Ag-Cu-Ni Quaternary System at the Sn-Rich Corner, Journal of Electronic Materials, Vol. 33, No. 10, pp.1071-1079, 2004.