Publisher
Springer Science and Business Media LLC
Subject
Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Reference30 articles.
1. S. Kyung-ah, L. Anna, L. Gerald, G. Manuel, H. Toshiro, H. Richard, S. Leif, and S. William, Nanosci. Nanotechnol. Lett. 2, 2 (2010).
2. T. Funaki, J. C. Balda, J. Junghans, A. A. Kashyap, F.D. Barlow, H. A. Mantooth, T. Kimoto, and T. Hikihara, IEICE Electron Express 1, 523 (2004).
3. V.R. Manikam and K.Y. Cheong, IEEE Trans. Compon. Packag. Manuf. Technol. 1, 4 (2011).
4. C. Buttay, A, Masson, J. Li, M. Johnson, M. Lazar, C Raynaud, and H. Morel, IMAPS High Temperature Electronics Network HITEN, pp. 1–7 (2011).
5. M. Knoerr, S. Kraft, and A. Schletz, in 12th Electronics Packaging Technology Conference (2010).
https://doi.org/10.1109/eptc.2010.5702605
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