1. Z. Cheng, G. Taraschi, M. Currie, C. Leitz, M. Lee, A. Pitera, T. Langdo, J. Hoyt, D. Antoniadis, and E. Fitzgerald, J. Electron. Mater. 30, L37 (2001).
2. J. Zahler, C.-G. Ahn, S. Zaghi, H. Atwater, C. Chu, and P. Iles, Thin Solid Films 403, 558 (2002).
3. C.H. Huang, M.Y. Yang, A. Chin, W.J. Chen, C.X. Zhu, B.J. Cho, M.-F. Li, and D.L. Kwong, 2003 Symp. VLSI Technology (Piscataway, NJ: IEEE, 2003), pp. 119–120.
4. M.I. Current, I.J. Malik, M. Fuerfanger, M. Korolik, S. Kang, H. Kirk, M. Fang, S.N. Farrens, and F.J. Henley, Silicon-on-Insulator Technology and Devices X. Proceedings of the Tenth International Symposium (Electrochemical Society Proceedings vol. 2001–3), pp. 75–78.
5. I.J. Malik, S.W. Bedell, H. Kirk, M. Korolik, S. Kang, M.I. Current, and F.J. Henley, 2000 International Conference on Solid State Devices and Materials X (Tokyo: Business Center for Academic Societies Japan, 2000), pp. 490–491.