Perpendicular Growth Characteristics of Cu-Sn Intermetallic Compounds at the Surface of 99Sn-1Cu/Cu Solder Interconnects-Reference-Cited by-同舟云学术

Perpendicular Growth Characteristics of Cu-Sn Intermetallic Compounds at the Surface of 99Sn-1Cu/Cu Solder Interconnects

Published:2015-09-22 Issue:12 Volume:44 Page:4836-4845
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Chen Zhiwen,Liu Changqing,Wu Yiping,An Bing

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-015-4043-7.pdf

Reference39 articles.

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5. J.H.L. Pang, T.H. Low, B.S. Xiong, X. Luhua, and C.C. Neo, Thin Solid Films 462–463, 370 (2004).

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