Conversion between standard and low-alpha lead in solder bumping production lines-Reference-Cited by-同舟云学术

Conversion between standard and low-alpha lead in solder bumping production lines

Author:

Roberson M. W.,Deane P. A.,Bonafede S.,Huffman A.,Nangalia S.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

Reference5 articles.

1. M.W. Roberson, Proc. 1998 Int. Symp. Adv. Pkg. Mater. (Piscataway, NJ: IEEE, 1998), pp. 111–116.

2. Equinox single head fountain plater (Model EQ212PM), Semitool, 655 West Reserve Drive, Kalispell MT 59901.

3. Pure Technologies, Inc., 1266 West Paces Ferry Road, NW #519, Atlanta, GA 30327.

4. M. Tucker, Spectrum Sciences Inc., 3050 Oakmead Village Drive, Santa Clara, CA 95051.

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Packaging Materials;Springer Handbook of Electronic and Photonic Materials;2017

3. Packaging Materials;Springer Handbook of Electronic and Photonic Materials;2006

4. Development of Cu-Core Pb-Free Solder Bumps;Journal of The Electrochemical Society;2005