Development of Cu-Core Pb-Free Solder Bumps-Reference-Cited by-同舟云学术

Development of Cu-Core Pb-Free Solder Bumps

Published:2005 Issue:1 Volume:152 Page:G68
ISSN:0013-4651
Container-title:Journal of The Electrochemical Society
language:en
Short-container-title:J. Electrochem. Soc.

Author:

Mu Daobin,Kondo Kazuo,Maeda Junpei

Publisher

The Electrochemical Society

Subject

Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials

Reference18 articles.

1. Tin–lead (SnPb) solder reaction in flip chip technology

2. E. Hayashi, S. Wakiyama, K. Harada, S. Baba, T. Ozawa, A. Maeda, and M. Kimura, in2003 International Conference on Electronics Packaging Proceedings, IEEE CPMT, IMPS Japan, and JIEP, p. 465 (2003).

3. Shape Evolution of Electrodeposited Copper Bumps

4. Shape Evolution of Electrodeposited Copper Bumps with High Peclet Numbers

5. Current Evolution of Electrodeposited Copper Bumps with Photoresist Angle

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1. Self-alignment Ability of Copper Ball on Soldering for Packaging-on-Packaging and Measurement of Oxidation Layer Thickness by Lightness Value;Transactions of The Japan Institute of Electronics Packaging;2015

2. Electromigration in Cu-Cored Sn-3.5Ag-0.7Cu Solder Interconnects Under Current Stressing;Journal of Electronic Materials;2014-02-11

3. Microstructure Evolution of Cu-Cored Sn Solder Joints Under High Temperature and High Current Density;Journal of Electronic Materials;2013-05-04

4. Abnormal accumulation and rotation of Sn in Cu-cored Sn solder joints under current stressing;Materials Chemistry and Physics;2012-10

5. Interfacial reactions and mechanical properties of ball-grid-array solder joints using Cu-cored solder balls;Journal of Electronic Materials;2006-11