Self-alignment Ability of Copper Ball on Soldering for Packaging-on-Packaging and Measurement of Oxidation Layer Thickness by Lightness Value-Reference-Cited by-同舟云学术

Self-alignment Ability of Copper Ball on Soldering for Packaging-on-Packaging and Measurement of Oxidation Layer Thickness by Lightness Value

Published:2015 Issue:1 Volume:8 Page:162-165
ISSN:1883-3365
Container-title:Transactions of The Japan Institute of Electronics Packaging
language:en
Short-container-title:Transactions of The Japan Institute of Electronics Packaging

Author:

Kawasaki Hiroyoshi¹²,Hattori Takahiro¹,Roppongi Takahiro¹,Soma Daisuke¹,Sato Isamu¹,Kawamata Yuji¹,Araki Koji²,Tsuge Akihiko²

Affiliation:

1. Senju Metal Industry. Co., Ltd.

2. Department of Applied Chemistry, Kyushu Institute of Technology

Publisher

Japan Institute of Electronics Packaging

Link

https://www.jstage.jst.go.jp/article/jiepeng/8/1/8_162/_pdf

Reference11 articles.

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2. [2] K. Uenishi, Y. Kohara, S. Sakatani, T. Saeki, K. F. Kobayashi, and M. Yamamoto, "Melting and joining behavior of Sn/Ag and Sn-Ag/Sn-Bi plating on Cu core ball," Mater. Trans., Vol. 8, pp. 1833-1839, 2002.

3. [3] I. Shohji, Y. Shiratori, H. Yoshida, M. Mizukami, and A. Ichida, "Growth Kinetics of Reaction Layers in Flip Chip Joints with Cu-cored Lead-free Solder Balls," Mat. Trans., Vol. 45, pp. 754-758, 2004.

4. [4] D. B. Mu, K. Kondo, and J. Maeda, "Development of Cu-core Pb-free solder bumps," J. Electrochem. Soc., Vol. 152, pp. 68-72, 2005.

5. [5] X. S. Wanga, S. Jiaa, H. H. Rena, and P. Pana, "Effects of solder balls and arrays on the failure behavior in Package-on-Package structure," MICROELECTRON REL., Vol. 54, No. 3, pp. 633-640, 2014.