1. Environmental Concepts Inc., “A History of Lead,” March 12, 1997, May 3, 2001 〈http://www.gate.net/~verstraa/history.htm〉
2. National Center for Manufacturing Sciences, “Final Report on Lead-Free Alternatives Project” (Ann Arbor, MI: NCMS, 1998).
3. Japan Electronic Industry Development Association (JEIDA), “Challenges and Efforts toward Commercialization of Lead-Free Solder—Road Map 2000 for Commercialization of Lead-Free Solder” (Tokyo: JEIDA, 2000).
4. National Electronics Manufacturing Initiative, “NEMI Group Recommends Tin/Silver/Copper Alloy as Industry Standard for Lead-Free Solder Reflow in Board,” Press Release, 24 January 2000, 〈http://www.nemi.org/newsroom/PR/2000/PR012400.html〉
5. K. Nimmo, Proc. IPC Lead-Free Summit (San Jose, CA: SMTA, 1999), pp. 371–377.