Compensation of Surface Roughness Using an Au Intermediate Layer in a Cu Direct Bonding Process
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Published:2018-06-15
Issue:9
Volume:47
Page:5403-5409
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ISSN:0361-5235
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Container-title:Journal of Electronic Materials
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language:en
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Short-container-title:Journal of Elec Materi
Author:
Noma HirokazuORCID, Kamibayashi Takumi, Kuwae Hiroyuki, Suzuki Naoya, Nonaka Toshihisa, Shoji Shuichi, Mizuno Jun
Funder
Japan Ministry of Education, Culture, Sports Science & Technology MEXT Nanotechnology Platform Support Project of Waseda University
Publisher
Springer Science and Business Media LLC
Subject
Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
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