Interdiffusion mechanism and thermal conductance at the interfaces in Cu-to-Cu bonds achieved by coating nanolayers-Reference-Cited by-同舟云学术

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Interdiffusion mechanism and thermal conductance at the interfaces in Cu-to-Cu bonds achieved by coating nanolayers

Published:2024-03 Issue: Volume:46 Page:103985
ISSN:2468-0230
Container-title:Surfaces and Interfaces
language:en
Short-container-title:Surfaces and Interfaces

Author:

Jiang Xiaofan,Tao Zeming,Li Yuan^ORCID,Sun Fangyuan^ORCID,Yu Daquan^ORCID,Zhong Yi^ORCID

Funder

National Natural Science Foundation of China

Fundamental Research Funds for the Central Universities

Publisher

Elsevier BV

Reference36 articles.

1. A critical review of thermal boundary conductance across wide and ultrawide bandgap semiconductor interfaces;Feng;ACS Appl. Mater. Interfaces,2023

2. Thermal management and packaging of wide and ultra-wide bandgap power devices: a review and perspective;Qin;J. Phys. D Appl. Phys.,2023

3. Properties for thermally conductive interfaces with wide band gap materials;Khan;ACS Appl. Mater. Interfaces,2022

4. Power Electronic Modules: Design and Manufacture;Sheng,2004

5. Perspective on thermal conductance across heterogeneously integrated interfaces for wide and ultrawide bandgap electronics;Cheng;Appl. Phys. Lett.,2022

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Molecular dynamics simulation study of Zr interposer promoting Cu-Cu low-temperature hybrid bonding;Materials Today Communications;2024-08

2. Thermal Transport Properties of Hybrid Bonding With Passivation;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

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