Kinetics of Au-containing ternary intermetallic redeposition at solder/UBM interface-Reference-Cited by-同舟云学术

Kinetics of Au-containing ternary intermetallic redeposition at solder/UBM interface

Published:2001-09 Issue:9 Volume:30 Page:1138-1144
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Lee Jong-Hyun,Park Jong-Hwan,Shin Dong-Hyuk,Lee Yong-Ho,Kim Yong-Seog

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-001-0141-9.pdf

Reference21 articles.

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2. Z. Mei, A.J. Sunwoo, and J.W. Morris, Jr., Metall. Trans. A 23A, 857 (1992).

3. A.J. Sunwoo, J.W. Morris, Jr., and G.K. Lucey, Jr., Metall. Trans. A 23A, 1323 (1992).

4. S. Bader, W. Gust, and H. Hieber, Acta Metall. Mater. 43, 329 (1995).

5. P.T. Vianco, P.L. Hopkins, K.L. Erickson, and R. Davidson, Design & Reliability of Solders and Solder Interconnections, ed. R.K. Mahidhara, D.R. Frear, S.M.L. Sastry, K.L. Murty, P.K. Liaw, and W.L. Winterbottom, (Warrendale, PA: TMS, 1997), p. 161.

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