Microstructure Development of Mechanical-Deformation-Induced Sn Whiskers-Reference-Cited by-同舟云学术

Microstructure Development of Mechanical-Deformation-Induced Sn Whiskers

Published:2007-09-19 Issue:12 Volume:36 Page:1732-1734
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Lin Shih-Kang,Yorikado Yuhi,Jiang Junxiang,Kim Keun-Soo,Suganuma Katsuaki,Chen Sinn-Wen,Tsujimoto Masanobu,Yanada Isamu

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

https://link.springer.com/content/pdf/10.1007/s11664-007-0284-4.pdf

Reference8 articles.

1. G.T. Galyon, IEEE T. Electron. Pa. M. 28 (2005) 94

2. B.-Z. Lee, D.N. Lee, Acta Mater. 46 (1998) 3701

3. W.J. Boettinger, C.E. Johnson, L.A. Bendersky, K.-W. Moon, M.E. Williams, G.R. Stafford, Acta Mater. 53 (2005) 5033

4. W.J. Choi, G. Galyon, K.N. Tu, and T.Y. Lee, Handbook of Lead-free Solder Technology for Microelectronic Assemblies, ed. K.J. Puttlitz and K.A. Stalter (Marcel Dekker Inc., New York, 2004), pp. 851–914

5. Y. Yorikado, K.-S. Kim, K. Suganuma, M. Tsujimoto, and I. Yanada, in preparation for publication (2007)

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