Whisker and Hillock formation on Sn, Sn–Cu and Sn–Pb electrodeposits-Reference-Cited by-同舟云学术

Whisker and Hillock formation on Sn, Sn–Cu and Sn–Pb electrodeposits

Published:2005-11 Issue:19 Volume:53 Page:5033-5050
ISSN:1359-6454
Container-title:Acta Materialia
language:en
Short-container-title:Acta Materialia

Author:

Boettinger W.J.,Johnson C.E.,Bendersky L.A.,Moon K.-W.,Williams M.E.,Stafford G.R.

Publisher

Elsevier BV

Subject

Metals and Alloys,Polymers and Plastics,Ceramics and Composites,Electronic, Optical and Magnetic Materials

Reference43 articles.

1. Growth Mechanism of Proper Tin-Whisker

2. Chason E, Kabakian L, Kumar S. Materials for space applications. In: Chipara M, Edwards DL, Benson RS, Phillips S, editors. Mater Res Soc Symp Proc, vol. 851, Warrendale, PA; 2005. p. NN5.17.

3. Accelerated growth of tin whiskers

4. Galyon GT. Annotated Tin Whisker Bibliography, National Electronics Manufacturing Initiative Inc. (NEMI), Herdon, VA, July; 2003. Available from: www.nemi.org.

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