Publisher
Springer Science and Business Media LLC
Subject
Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Reference17 articles.
1. 3D Silicon & Glass Interposers, Yole Development (2012).
2. J. Lau, TSV Interposer: the most cost-effective integrator for 3d IC integration, ASME Interpack 2011-52189 (2011).
3. ITRS Technology Roadmap 2013. www.itrs.net .
4. Y.Y.G Hoe, T.G. Yue, D. Pinjala, C.T Chong, J.H. Lau, Z. Xiaowu, et’al., IEEE 11th Electronics Packaging Technology Conference (2009).
5. B. Banijamali, S. Ramalingam, K. Nagarajan, and R. Chaware, Advanced Reliability Study of TSV Interposers and Interconnects for the 28Â nm Technology FPGA (ECTC, 2011), p. 285.
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