Affiliation:
1. Industrial Technology Research Institute (ITRI), Hsinchu, Taiwan
Abstract
The significant roles of Cu-filled TSV passive interposers for 3D IC integration are investigated in this study. Emphasis is placed on the roles they play as: (1) substrates; (2) carriers; (3) thermal management tools; and (4) reliability buffers. It is shown that the Cu-filled TSV passive interposers are the most cost-effective integrator for 3D IC integration system-in-package (SiP).
Cited by
9 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Recent Advances and Trends in Multiple System and Heterogeneous Integration With TSV Interposers;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-01
2. Multiple System and Heterogeneous Integration with TSV-Interposers;Chiplet Design and Heterogeneous Integration Packaging;2023
3. SID-Mesh: Diagonal Mesh Topology for Silicon Interposer in 2.5D NoC with Introducing a New Routing Algorithm;2021 ACM/IEEE International Workshop on System Level Interconnect Prediction (SLIP);2021-11
4. 2.5D IC Integration;Semiconductor Advanced Packaging;2021
5. Hardware Security For and Beyond CMOS Technology;Proceedings of the 2020 International Symposium on Physical Design;2020-03-20