Effect of Amount of Cu on the Intermetallic Layer Thickness Between Sn-Cu Solders and Cu Substrates-Reference-Cited by-同舟云学术

Effect of Amount of Cu on the Intermetallic Layer Thickness Between Sn-Cu Solders and Cu Substrates

Published:2009-08-26 Issue:12 Volume:38 Page:2479-2488
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Alam M. E.,Nai S. M. L.,Gupta M.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-009-0925-x.pdf

Reference32 articles.

1. J.L. Freer and J.W. Morris Jr., J. Electron. Mater. 21, 647 (1992).

2. M. Hansen and K. Anderko, Constitution of Binary Alloys (New York: McGraw-Hill, 1958).

3. F. Hua and J. Glazer, Design and Reliability of Solders and Solder Interconnections, ed. R.K. Mahidhara, D.R. Frear, S.M.L. Sastry, K.L. Liaw, and W.L. Winterbottom (Warrendale, PA: The Minerals, Metals and Materials Society, 1997), pp. 65–74.

4. J. Glazer, Int. Mater. Rev. 40, 65 (1995).

5. S.M.L. Nai, J. Wei, and M. Gupta, J. Alloy. Compd. 473, 100 (2009).

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