Microstructure and Properties of Sn-10Bi-xCu Solder Alloy/Joint-Reference-Cited by-同舟云学术

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Microstructure and Properties of Sn-10Bi-xCu Solder Alloy/Joint

Published:2016-05-11 Issue:7 Volume:45 Page:3702-3711
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Lai Zhongmin,Ye Dan

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-016-4561-y.pdf

Reference25 articles.

1. X. Chen, F. Xue, J. Zhou, and Y. Yao, J. Alloy. Compd. 377, 633 (2015).

2. H. Jung, H. Kim, and W. Lee, J. Electron. Mater. 1067, 35 (2006).

3. H. Sun, Q. Li, and Y.C. Chan, J. Mater. Sci.: Mater. Electron. 4380, 25 (2014).

4. L. Zhang, L. Sun, and Y. Guo, J. Mater. Sci.: Mater. Electron. 7629, 26 (2015).

5. D. Ye, C. Du, M. Wu, and Z. Lai, J. Mater. Sci.: Mater. Electron. 3629, 26 (2015).

Cited by 21 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effects of alloying elements on the interfacial segregation of bismuth in tin-based solders;Materials Today Communications;2023-06

2. Aging Interfacial Structure and Abnormal Tensile Strength of SnAg3Cu0.5/Cu Solder Joints;Materials;2022-12-16

3. Understanding the surface segregation of solute atoms in Sn-Bi–based solder from first principles;Europhysics Letters;2022-09-01

4. Effect of Cu Addition on the Microstructure and Mechanical Properties of Sn-58Bi-0.5Ag Solder Alloys;Journal of Electronic Materials;2022-04-11

5. Effect of soldering time on the microstructure and mechanical properties of SnBi/SACBN/Cu solder joint;Journal of Materials Science: Materials in Electronics;2022-03-09

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