Effect of Cu Addition on the Microstructure and Mechanical Properties of Sn-58Bi-0.5Ag Solder Alloys

Author:

Yao Zongxiang,Ling Diying,Liu Yikai,Sun Jiashuai,Yin LimengORCID,Wang Gang,Zhang Long

Funder

National Natural Science Foundation of China

Graduate Science and Technology Innovation Program of Chongqing University of Science and Technology

Key Laboratory of Jiangxi Province for Aeronautical Component Forming and Connection

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Reference19 articles.

1. X.K. Zhu, H.H. Lou, X. Qu, J.J. Wang, L. Taekoo, and H. Wang, The Challenge of changeover to lead-free in electronic packaging. Electron. Packag. 05, 2 (2005).

2. Z.D. Xia, Y.P. Lei, and Y.W. Shi, Research and development of advanced environmental-friendly lead-free solder. Electron. Process. Technol. 05, 185 (2002).

3. P.L. Liu, and J.K. Shang, Interfacial segregation of bismuth in copper tin-bismuth solder interconnect. Scr. Mater. 44, 1019 (2001).

4. O. Mokhtari, and H. Nishikawa, Effects of In and Ni addition on microstructure of Sn-58Bi solder joint. Electron. Mater. 43, 4158 (2014).

5. X.Y. Liu, M.L. Huang, C.M.L. Wu, and L. Wang, Effect of Y2O3 particles on microstructure formation and shear properties of Sn-58Bi solder. Mater. Sci. Mater. Electron. 21, 1046 (2010).

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