Microstructure and Reliability Comparison of Different Pb-Free Alloys Used for Wave Soldering and Rework-Reference-Cited by-同舟云学术

Microstructure and Reliability Comparison of Different Pb-Free Alloys Used for Wave Soldering and Rework

Published:2009-08-25 Issue:12 Volume:38 Page:2628-2646
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Snugovsky Polina,Bagheri Zohreh,Hamilton Craig

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-009-0923-z.pdf

Reference12 articles.

1. C. Hamilton, P. Snugovsky, and M. Kelly, Proceedings of the Pan Pacific Microelectronics SMTA Conference (Mani, HI: SMT, 2007).

2. C. Hamilton and M. Kelly, Proceedings of IPC Printed Circuits Expo, APEX Conference (Los Vegas, NV: IPC, 2008).

3. C. Hamilton, P. Snugovsky, M. Moreno, T.H. Ng, J.␣Fangkangwanwong, M. Kelly, and J. Bielick, Proceedings of the Pan Pacific Microelectronics SMTA Conference (Kamuela, HI: SMTA, 2009).

4. C. Hamilton, P. Snugovsky, and M. Kelly, Proceedings of SMTA International Conference (Edina, MN: SMTA, 2006).

5. IPC, IPC-9701A Performance Test Methods and Qualification Requirements for Solder Mount Attachments (2006).

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