Applying microscopic analytic techniques for failure analysis in electronic assemblies-Reference-Cited by-同舟云学术

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Applying microscopic analytic techniques for failure analysis in electronic assemblies

Published:2019-08-13 Issue:1 Volume:49 Page:
ISSN:2287-4445
Container-title:Applied Microscopy
language:en
Short-container-title:Appl. Microsc.

Author:

Grosshardt Otto^ORCID,Nagy Boldizsár Árpád,Laetsch Anette

Publisher

Springer Science and Business Media LLC

Link

http://link.springer.com/content/pdf/10.1186/s42649-019-0009-1.pdf

Reference21 articles.

1. B. Balogh, P. Gordon, R. Kovacs, C. Nagynemedi, P.J. Szabo, G. Harsanyi, Failure analysis methods in electronics assembly technology. Mater. Sci. Forum 589, 349–354 (2008b). https://doi.org/10.4028/www.scientific.net/MSF.589.349

2. B. Balogh, G. Harsanyi, R. Kovacs, C. Nagynemedi, B. Papp, Analysis of solder joint failures arisen during the soldering process. Periodica Polytechnica Electrical Eng. 52(1–2), 5–11 (2008a). https://doi.org/10.3311/pp.ee.2008-1-2.01

3. B. Balogh, R. Kovacs, J. Majsai, in 29th International Spring Seminar on Electronic Technology. Applications and comparison of failure analysis methods (St. Marienthal, Germany, 2006), pp. 14–19. https://doi.org/10.1109/ISSE.2006.365352

4. T. Castello, D. Rooney, D. Shangguan, Failure analysis techniques for lead-free solder joints. Soldering Surf. Mount Technol. 18(4), 21–27 (2006). https://doi.org/10.1108/09540910610717875

5. R.F. Champaign, K. Wiggins, Shock induced fracture of SAC solder balls under tensile load. Microsc. Microanal. 13(2), 1136–1137 (2007). https://doi.org/10.1017/S1431927607073965

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Failures in Soldering;Analysis and Prevention of Component and Equipment Failures;2021-08-30

2. Terahertz Based Machine Learning Approach to Integrated Circuit Assurance;2021 IEEE 71st Electronic Components and Technology Conference (ECTC);2021-06

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