Dissolution Rate of Electronics Packaging Surface Finish Elements in Sn3.0Ag0.5Cu Solder-Reference-Cited by-同舟云学术

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Dissolution Rate of Electronics Packaging Surface Finish Elements in Sn3.0Ag0.5Cu Solder

Published:2019-06-11 Issue:8 Volume:48 Page:5241-5256
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Hillman Dave,Wilcoxon Ross^ORCID,Pearson Tim,McKenna Paul

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-019-07316-1.pdf

Reference38 articles.

1. W.G. Bader, Welding Research Supplement, December 1969, p. 551s.

2. M. Bester, InterNEPCON Proceedings, 1968, p. 211.

3. F.G. Foster, ASTM Special Technical Publications, No. 319, 1962.

4. S.D. Ebneter, NASA Technical Memorandum X-53335, Oct. 1965.

5. P. Vianco, Soldering Handbook, American Welding Society, ISBN 0-87171-618-6, p. 182.

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