Microstructure Evolution and the Constitutive Relations of High-Temperature Solders-Reference-Cited by-同舟云学术

Microstructure Evolution and the Constitutive Relations of High-Temperature Solders

Published:2009-03-31 Issue:6 Volume:38 Page:802-809
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Schoeller Harry,Bansal Shubhra,Knobloch Aaron,Shaddock David,Cho Junghyun

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-009-0767-6.pdf

Reference18 articles.

1. J.W. Morris and H.L. Reynolds, Proceedings of the Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference, INTERpack’97, vol. 2 (1997), p.␣1529.

2. J. Glazer, J. Electron. Mater. 23, 693 (1994).

3. T.T. Hitch, K. Palit, and A.N. Prabhu, International Conference on Electronic Assembly Material and Process Challenges, vol. 2 (1996), p. 1107.

4. N.C. Lee, Solder Surf. Mt. Technol. 9, 116 (1997).

5. M. Abtew and G. Selvaduray, Mater. Sci. Eng. Rep. R27, 95 (2000).

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