Microstructural Evolution of Intermetallic Compounds in TCNCP Cu Pillar Solder Joints-Reference-Cited by-同舟云学术

Microstructural Evolution of Intermetallic Compounds in TCNCP Cu Pillar Solder Joints

Published:2015-09-30 Issue:1 Volume:45 Page:51-56
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Liang Chien-Lung,Lin Kwang-Lung,Peng Jr-Wei

Funder

Ministry of Science and Technology of the Republic of China

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-015-4065-1.pdf

Reference23 articles.

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2. B. Schmaltz, IEEE Int. Symp. Adv. Packag. Mater. (2013), p. 93.

3. Y. Tomita, T. Morifuji, T. Ando, M. Tago, R. Kajiwara, Y. Nemoto, T. Fujii, Y. Kitayama, and K. Takahashi, 51st IEEE Electron. Compon. Technol. Conf. (2001), p. 353.

4. J.Y. Juang, S.T. Lu, S.C. Chung, S.M. Cheng, J.S. Peng, Y. L. Lu, P.C. Chang, C. W. Fan, C.J. Zhan, and T.H. Chen, 62nd IEEE Electron. Compon. Technol. Conf. (2012), p. 114.

5. K.W. Jang, W.S. Kwon, and M.J. Yim, IEEE Trans. Compon. Packag. Technol. 27, 608 (2004).

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