Laser Drilling and Conducting Film Formation of Vias in Silicon-Reference-Cited by-同舟云学术

Laser Drilling and Conducting Film Formation of Vias in Silicon

Published:2015-10-15 Issue:12 Volume:44 Page:4928-4932
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Hidai Hirofumi,Matsusaka Souta,Chiba Akira,Morita Noboru

Funder

Science Foundation of Hunan Education Department

Science Foundation of Hunan

Project of the Key Discipline Development of Hunan

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-015-4097-6.pdf

Reference11 articles.

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3. H. Nakagawa, K. Ogawa, A. Kihara, and T. Hirogaki, J. Mater. Process. Technol. 191, 293 (2007).

4. I. Koiwa, Y. Wakuda, T. Suzuki, T. Tamura, A. Fujisaki, K. Koiwa, T. Yamada, S. Ando, and A. Matsuno, in 2009 Electronic Components and Technology Conference (2009), p. 879.

5. A. Kestenbaum, J.F. D’Amico, B.J. Blumenstock, and M.A. Deangelo, IEEE Trans. Compon. Hybrids Manuf. Technol. 13, 1990 (1055).

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