1. J. Hornberger, B. McPherson, and B. Passmore, Extreme Environment Electronics, ed. J.D. Cressler and H.A. Mantooth (Boca Raton: CRC Press, 2013), p. 803.
2. M.K. Das, C. Capell, D.E. Grider, S. Leslie, J. Ostop, R. Raju, M. Schutten, J. Nasadoski, and A. Hefner, IEEE ECCE Conference (2011).
3. S.H. Ryu, C. Capell, C. Jonas, M.J. O’Loughlin, J. Clayton, E.V. Brunt, K. Lam, J. Richmond, A. Kadavelugu, S. Bhattacharya, A.A. Burk, A. Agarwal, D. Grider, S.T. Allen, and J.W. Palmour, Materials Science Forum, ed. H. Okumura, H. Harima, T. Kimoto, M. Yoshimoto, H. Watanabe, T. Hatayama, H. Matsuura, T. Funaki, and Y. Sano (Scientific.Net, 2014), p. 1030.
4. D.W. Berning, T.H. Duong, J.M. Ortiz-Rodriguez, A. Rivera-Lopez, and A.R. Hefner, IEEE IAS Conference (2008).
5. C.E. Weitzel, J.W. Palmour, C.H. Carter Jr, K. Moore, K.J. Nordquist, S. Allen, C. Thero, and M. Bhatnagar, IEEE Trans. Electron. Dev. 43, 10 (1996).