Relieving Hot-Spot Temperature and Current Crowding Effects During Electromigration in Solder Bumps by Using Cu Columns-Reference-Cited by-同舟云学术

Relieving Hot-Spot Temperature and Current Crowding Effects During Electromigration in Solder Bumps by Using Cu Columns

Published:2007-09-11 Issue:10 Volume:36 Page:1348-1354
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Liang S.W.,Chang Y.W.,Chen Chih

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-007-0232-3.pdf

Reference16 articles.

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3. K.N. Tu, J. Appl. Phys., 94, 5451 (2003).

4. C.Y. Liu, C. Chen, C.N. Liao, K.N. Tu, Appl. Phys. Lett., 75, 58 (1999).

5. E.C.C. Yeh, W.J. Choi, K.N. Tu, Appl. Phys. Lett., 80, 4 (2002).

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