1. B.E. Stine, D.O. Ouma, R.R. Divecha, D.S. Boning, J.E. Chung, D.L. Hetherington, I. Ali, G. Shinn, J. Clark, O.S. Nakagawa, and S.Y. Oh, Proc. Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conf, Piscataway, NJ: IEEE, (1997), p. 266.
2. D. Ouma, C. Oji, D. Boning, J. Chung, D. Hetherington, and P. Merkle, Proc. Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conf. Piscataway, NJ: IEEE, (1998), p. 20.
3. B.E. Stine, D.S. Boning, J.E. Chung, L. Camilletti, F. Kruppa, E.R. Equi, W. Loh, S. Prasad, M. Muthukrishnan, D. Towery, M. Berman, and A. Kapoor, IEEE Trans. Electron. Dev. 45, 665 (1998).
4. B.E. Stine, D.O. Ouma, R.R. Divecha, D.S. Boning, J.E. Chung, D.L. Hetherington, C.R. Harwood, O.S. Nakagawa, and S.Y. Oh, IEEE Trans. Semicond. Manufact. 11, 129 (1998).
5. T.H. Smith, S.J. Fang, D.S. Boning, G.B. Shinn, and J.A. Stefani, Proc. Chemical-Mechanical Planarization for USLI Multilevel Interconnection Conf. 97 Piscataway, NJ: IEEE, (1999).