Author:
Dong Wenxing,Shi Yaowu,Lei Yongping,Xia Zhidong,Guo Fu
Publisher
Springer Science and Business Media LLC
Subject
Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Reference15 articles.
1. Bo Li, Yaowu Shi, Yongping Lei, Fu Guo, Zhidong Xia, and Bin Zong. J.Electron. Mater., 34(2005)217. doi: 10.1007/s11664-005-0207-1 .
2. Wenxing Dong, Yaowu Shi, Yongping Lei, Zhidong Xia, Fu Guo. J.Electron. Mater. 37, 982(2008). doi: 10.1007/s11664-008-0458-8 .
3. M.A. Matin, W.P. Vellinga, M.G.D. Geers. Mater. Sci. Eng. A.73, 445(2007).
4. D.-S. Jiang, Y.-P. Wang, and C.S. Hsiao, Electronics Packaging Technology Conference (2006), p. 385.
5. C.M.L, Wu Y and W Wong, J Mater Sci. Mater Electron. 18, 77(2007). doi: 10.1007/s10854-006-9022-6 .
Cited by
11 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献