Author:
Peng L.,Lim D.F.,Zhang L.,Li H.Y.,Tan C.S.
Publisher
Springer Science and Business Media LLC
Subject
Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Reference14 articles.
1. R. Patti, Proc. IEEE 94, 1214 (2006).
2. P.R. Morrow, C.-M. Park, S. Ramanathan, M.J. Kobrinsky, and M. Hermes, IEEE Electron. Dev. Lett. 27, 335 (2006).
3. S. Pozder, A. Jain, R. Chatterjee, Z. Huang, R.E. Jones, E. Acosta, B. Marlin, G. Hillmann, M. Sobczak, G. Kreindl, S. Kanagavel, H. Kostner, and S. Pargfrieder, IEEE International Interconnect Technology Conference (IITC) (CA, USA: Burlingame, 2008), p. 46.
4. C.S. Tan, R.J. Gutmann, and L.R. Reif, Wafer Level 3D ICs Process Technology (New York: Springer, 2008).
5. T.H. Kim, M.M.R. Howlader, T. Itoh, and T. Suga, J. Vac. Sci. Technol. A 21, 449 (2003).
Cited by
4 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献