Enhanced Cu-to-Cu direct bonding by controlling surface physical properties-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Enhanced Cu-to-Cu direct bonding by controlling surface physical properties

Published:2017-02-07 Issue:3 Volume:56 Page:035503
ISSN:0021-4922
Container-title:Japanese Journal of Applied Physics
language:
Short-container-title:Jpn. J. Appl. Phys.

Author:

Chiang Po-Hao,Liang Sin-Yong,Song Jenn-Ming,Huang Shang-Kun,Chiu Ying-Ta,Hung Chih-Pin

Publisher

IOP Publishing

Subject

General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering

Link

http://stacks.iop.org/1347-4065/56/i=3/a=035503/pdf

Reference30 articles.

1. Low temperature direct Cu-Cu bonding with low energy ion activation method

2. Microstructure evolution and abnormal grain growth during copper wafer bonding

3. Bumpless Interconnect Through Ultrafine Cu Electrodes by Means of Surface-Activated Bonding (SAB) Method

4. Annealing temperature effect on the Cu-Cu bonding energy for 3D-IC integration

Cited by 13 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Impact of Non-Coplanarities on Microstructure and Properties of Sintered NP-Cu Interconnections;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

2. Microstructural effects of copper deposits on direct bonding for 3D IC integration;Journal of Materials Research and Technology;2024-01

3. Copper Bonding Technology in Heterogeneous Integration;Electronic Materials Letters;2023-04-19

4. Influence of high-current pulsed electron beam irradiation on element diffusion behavior and mechanical properties of TC4/304 stainless steel diffusion bonded joints;Materials Characterization;2023-04

5. Influence of high-current pulsed electron beam irradiation on elemental diffusion and mechanical properties of copper/316L stainless-steel bonded joints;Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms;2022-11

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号京ICP备18003416号-3