Author:
Jang Guh-Yaw,Duh Jenq-Gong
Publisher
Springer Science and Business Media LLC
Subject
Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Reference30 articles.
1. L.F. Miller, IBM Journal of Research and Development 13, 239 (1969).
2. J.H. Lau, Flip Chip Technologies (New York: McGraw-Hill, 1996), pp. 26–30.
3. G.R. Blackwell, The Electronic Packaging Handbook (Boca Raton, FL: CRC Press, 2000), pp. 4.4–4.25.
4. D.R. Frear and S. Thomas, MRS Bull. 28, 68 (2003).
5. M. Li, F. Zhang, W.T. Chen, K. Zeng, K.N. Tu, H. Balkan, and P. Elenius, J. Mater. Res. 17, 1612 (2002).
Cited by
18 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献