Transient Thermal Impedance Measurements on Low-Temperature-Sintered Nanoscale Silver Joints-Reference-Cited by-同舟云学术

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Transient Thermal Impedance Measurements on Low-Temperature-Sintered Nanoscale Silver Joints

Published:2012-09-08 Issue:11 Volume:41 Page:3152-3160
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Mei Yunhui,Wang Tao,Cao Xiao,Chen Gang,Lu Guo-Quan,Chen Xu

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-012-2233-0.pdf

Reference36 articles.

1. U. Scheuermann and P. Beckedahl, CIPS 2008 Proceedings (2008).

2. E. Schulze, C. Mertens, and A. Lindemann, PCIM Proceedings (2009), p. 217.

3. J. Rudzki, C. Mertens, and R. Sittig, IEEE PESC Proceedings (2004), p. 4178.

4. G-Q. Lu, G. Lei, and J.N. Calata, U.S. patent 0162557 (2009).

5. Y.H. Mei, G.-Q. Lu, X. Chen, S. Luo, and D. Ibitayo, IEEE Trans. Device Mater. Reliab. 11, 2 (2010).

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