Transient Thermal Impedance Characterization of New High Power Press Pack Diodes
Author:
Affiliation:
1. DITEN University of Genova,Genova,Italy
2. Poseico Power Electronics S.p.A,Genova,Italy
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx8/10609025/10608821/10608828.pdf?arnumber=10608828
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1. Impedance Modelling and Stability Analysis of Diode-Rectifier based HVDC Connected Offshore Wind Farms
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3. Study of the circulating current in the Modular Multilevel Converter for optimal operation mode in HVDC application;Marchesoni;EPE-ECCE 2015,2015
4. Partial-Power Converter Topology of Type II for Efficient Electric Vehicle Fast Charging
5. A Multi-Phase AC-DC Converter With Improved Power Quality for EV Charging Station
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