1. S. Bader, W. Gust, and H. Hieber, Acta Metall. Mater. 43, 329 (1995).
2. L. Barnstein and H. Bartholomew, Trans. TMS-AIME 236, 405 (1966).
3. D.M. Jacobson and S.P.S. Sangha, IEEE Trans. Comp., Packag. Manuf. Technol. 21, 515 (1998).
4. C.C. Lee, C.Y. Wang, and G. Matijasevic, J. Electron. Packag. 115, 201 (1993).
5. J.J. Licari, Multichip Module Design, Fabrication and Testing (New York, McGraw-Hill, 1995), pp. 137–203.