Intermetallic Reactions during the Solid-Liquid Interdiffusion Bonding of Bi2Te2.55Se0.45 Thermoelectric Material with Cu Electrodes Using a Sn Interlayer-Reference-Cited by-同舟云学术

Intermetallic Reactions during the Solid-Liquid Interdiffusion Bonding of Bi2Te2.55Se0.45 Thermoelectric Material with Cu Electrodes Using a Sn Interlayer

Published:2016-04-22 Issue:4 Volume:6 Page:92
ISSN:2075-4701
Container-title:Metals
language:en
Short-container-title:Metals

Author:

Chuang Chien-Hsun,Lin Yan-Cheng,Lin Che-Wei

Funder

Ministry of Science and Technology, Taiwan

Publisher

MDPI AG

Subject

General Materials Science,Metals and Alloys

Link

http://www.mdpi.com/2075-4701/6/4/92/pdf

Reference19 articles.

1. Interfacial reaction between n- and p-type thermoelectric materials and SAC305 solders

2. Polarity Effect in a Sn3Ag0.5Cu/Bismuth Telluride Thermoelectric System

3. Junctions and Diffusion Barriers for High Temperature Thermoelectric Modules;Zybala;Mater. Ceram./Ceram. Mater.,2010

4. Diffusion Soldering

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