1. For example, see J. E. Morris, Conductive Adhesives for Electronics Packaging, ed. J. Liu, (Arrowsmith, Bristol, U.K.: Electrochemical Publ. Ltd., 1999), pp. 36–77.
2. S. Macathy, Proc. Surface Mount Int. 27–31, 562 (August 1995).
3. J. Liu, Circuit World 19, 4 (1993).
4. C. P. Wang, D. Lu, L. Meyers, S. A. Vona, Jr., and Q. K. Tong, Proc. of the 1st IEEE Int. Symp. on Polymeric Electronics Packaging (Piscataway, NJ: IEEE, 1997), pp. 80–85.
5. Y. Fu, J. Liu, and M. Willander, Int. J. Adhesion and Adhesives 19, 281 (1999).