Rheological Behavior and Thermal Conductivities of Emulsion-Based Thermal Pastes-Reference-Cited by-同舟云学术

Rheological Behavior and Thermal Conductivities of Emulsion-Based Thermal Pastes

Published:2020-01-02 Issue:3 Volume:49 Page:2100-2109
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Yazdan Ali,Wang Jizhe,Nan Ce-Wen,Li Liangliang^ORCID

Funder

National Natural Science Foundation of China

Science and Technology on Advanced Ceramic Fibers and Composites Laboratory

Opening Project of Engineering Research Center of Nano-Geo Materials of Ministry of Education of China University of Geosciences

National Key Research and Development Program of China

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-019-07907-y.pdf

Reference60 articles.

1. X. Yang, C. Liang, T. Ma, Y. Guo, J. Kong, J. Gu, M. Chen, and J. Zhu, Adv. Compos. Hybrid Mater. 1, 207 (2018).

2. W. Dai, L. Lv, J. Lu, H. Hou, Q. Yan, F.E. Alam, Y. Li, X. Zeng, J. Yu, Q. Wei, X. Xu, J. Wu, N. Jiang, S. Du, R. Sun, J. Xu, C.P. Wong, and C.T. Lin, ACS Nano 13, 1547 (2019).

3. Z. Tian, J. Sun, S. Wang, X. Zeng, S. Zhou, S. Bai, N. Zhao, and C.P. Wong, J. Mater. Chem. A 6, 17540 (2018).

4. Z. Fang, M. Li, S. Wang, Y. Li, X. Wang, Y. Gu, Q. Liu, J. Tian, and Z. Zhang, Appl. Compos. Mater. 25, 1255 (2018).

5. F. Sarvar, D.C. Whalley, and P.P. Conway, in 1st IEEE Electron. Syst. Technol. Conf. Proceeding (2006), pp. 1292–1302.

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