Ti-Rich Barrier Layers Self-Formed on Porous Low-k Layers Using Cu(1 at.% Ti) Alloy Films-Reference-Cited by-同舟云学术

Ti-Rich Barrier Layers Self-Formed on Porous Low-k Layers Using Cu(1 at.% Ti) Alloy Films

Published:2010-03-31 Issue:8 Volume:39 Page:1326-1333
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Ito Kazuhiro,Kohama Kazuyuki,Tanaka Tomohisa,Mori Kenichi,Maekawa Kazuyoshi,Shirai Yasuharu,Murakami Masanori

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-010-1182-8.pdf

Reference19 articles.

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3. K. Numba, T. Ishigami, M. Enomoto, S. Kondo, H. Shinriki, D. Jeong, A. Shimizu, N.Saitoh, W-M. Li, S. Yamamoto, T. Kawasaki, T. Nakada, and N. Kobayashi, Proc. AMC (2006), p. 269.

4. H. Wojcik, M. Friedemann, F. Feustelt, M. Albert, S. Ohsiekt, J. Metzgert, J. Voss, J.W. Bartha, and C. Wenze, Proc. IITC (2007), p. 19.

5. D. Jeong, H. Inoue, and H. Shinriki, Proc. IITC (2008), p. 95.

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