Effects of plasma pretreatment on the process of self-forming Cu–Mn alloy barriers for Cu interconnects
Author:
Affiliation:
1. Division of Nanoscale Semiconductor Engineering, Hanyang University, Seoul 133-791, Korea
2. Division of Materials Science & Engineering, Hanyang University, Seoul 133-791, Korea
Funder
Samsung
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.4993051
Reference28 articles.
1. Ti-Rich Barrier Layers Self-Formed on Porous Low-k Layers Using Cu(1 at.% Ti) Alloy Films
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