Publisher
Springer Science and Business Media LLC
Subject
Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Cited by
31 articles.
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1. Interaction of advanced copper metallization with the assembly and interconnection technology;2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2022-04-25
2. Interaction of advanced copper metallization with the assembly and interconnection technology;2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2022-04-25
3. Diffusion Barrier Behaviors of V-Ta, V-Ta-N and V-Ta/V-Ta-N Alloy Films in Cu Interconnects;Journal of Electronic Materials;2020-04-17
4. Enhanced thermal stability of Cu alloy films by strong interaction between Ni and Zr (or Fe);Journal of Physics D: Applied Physics;2018-03-07
5. Ni-V(or Cr) Co-addition Cu alloy films with high stability and low resistivity;Materials Chemistry and Physics;2018-02