Experimental Investigation on the Effect of Ag Addition on Ternary Lead Free Solder Alloy –Sn–0.5Cu–3Bi

Author:

Jayesh S.ORCID,Elias Jacob

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Metals and Alloys,Mechanics of Materials,Condensed Matter Physics

Reference32 articles.

1. NCMS Lead-Free Solder Project Final Report. NCMS, National Center for Manufacturing Sciences, Ann Arbor, MI, Report 0401RE96, August 1997

2. M.M. Schwartz, Soldering: Understanding the Basics, 1st edn. (ASM International, Novelty, 2014)

3. C. Handwerker, U. Kattner, K.W. Moon, Fundamental properties of Pb-free solder alloys, in Lead-Free Soldering, ed. by J. Bath (Springer, Boston, 2007). https://doi.org/10.1007/978-0-387-68422-2_2

4. A. Sharif, Y.C. Chan, Mater. Sci. Eng. 106, 126–131 (2004)

5. J.C.J. Koo, Y.W. Lee, S.J. Hong, K.-S. Kim, H.M. Lee, J. Alloys Compd. 600, 126–132 (2014)

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