Capacitive Links for Power and Data Telemetry to Implantable Biomedical Microsystems-Reference-Cited by-同舟云学术

Capacitive Links for Power and Data Telemetry to Implantable Biomedical Microsystems

Published:2022 Issue: Volume: Page:763-784
ISSN:
Container-title:Handbook of Biochips
language:
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Author:

Sharif Mohammad A.,Sodagar Amir M.

Publisher

Springer New York

Link

https://link.springer.com/content/pdf/10.1007/978-1-4614-3447-4_13

Reference15 articles.

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2. Asgarian F, Sodagar AM (2010) A carrier-frequency-independent BPSK demodulator with 100% data-rate-to-carrier-frequency ratio. In: Biomedical circuits and systems conference (BioCAS), pp 29–32. https://doi.org/10.1109/BIOCAS.2010.5709563

3. Asgarian F, Sodagar AM (2011) Wireless telemetry for implantable biomedical microsystems. In: Laskovski AN (ed) Biomedical engineering trends in electronics. Communications and software. InTech, India, pp 21–44

4. Culurciello E, Andreou AG (2005) Capacitive coupling of data and power for 3D silicon-on-insulator. In: IEEE international symposium on circuits and systems (ISCAS), vol 4, pp 4142–4145. https://doi.org/10.1109/ISCAS.2005.1465543

5. Erfani R, Sodagar AM (2013) Amplitude-Engraving Modulation (AEM) scheme for simultaneous power and high-rate data telemetry to biomedical implants. In: Biomedical circuits and systems conference (BioCAS). IEEE, pp 290–293. https://doi.org/10.1109/BioCAS.2013.6679696

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