Copper Wire Bonding-Reference-Cited by-同舟云学术

Copper Wire Bonding

Published:2013-05-29 Issue: Volume: Page:1-9
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Container-title:Copper Wire Bonding
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Author:

Chauhan Preeti S.,Choubey Anupam,Zhong ZhaoWei,Pecht Michael G.

Publisher

Springer New York

Link

http://link.springer.com/content/pdf/10.1007/978-1-4614-5761-9_1

Reference38 articles.

1. J. Pan and P. Fraud, “Wire bonding challenges in optoelectronics packaging,” Proceedings of the 1st SME Annual Manufacturing Technology Summit: Dearborn, MI, 2004.

2. G. Ginsberg, Surface Mount and Related Technologies vol. 57: CRC, 1989.

3. E. Kim, “Wire bonding techniques,” 2004.

4. B. Langenecker, “Effects of ultrasound on deformation characteristics of metals,” Sonics and Ultrasonics, IEEE Transactions on, vol. 13, pp. 1–8, 1966.

5. M. Tarr, “Bonding to the chip face.”

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