Life prediction of copper wire bonds in commercial devices using principal component analysis (PCA)-Reference-Cited by-同舟云学术

Life prediction of copper wire bonds in commercial devices using principal component analysis (PCA)

Published:2019-08 Issue: Volume:99 Page:137-151
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Manoharan Subramani,Patel Chandradip,Dunford Steven,Beshears John,McCluskey Patrick

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

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3. Multi design variable optimization of QFN package on thick boards for enhanced board level reliability;Krishnamurthy,2016

4. Is the heterogeneous microstructure of SnAgCu (SAC) solders going to pose a challenge for heterogeneous integration?;Jiang,2017

5. Performance Assessment of MEMS Gyroscope and Shock Durability Evaluation of SAC305-X Solders for High Temperature Applications;Patel,2014

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