Aluminum-Scandium: A Material for Semiconductor Packaging-Reference-Cited by-同舟云学术

Aluminum-Scandium: A Material for Semiconductor Packaging

Published:2016-06-30 Issue:10 Volume:45 Page:5456-5467
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Geissler Ute,Thomas Sven,Schneider-Ramelow Martin,Mukhopadhyay Biswajit,Lang Klaus-Dieter

Funder

Deutsche Forschungsgemeinschaft

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-016-4756-2.pdf

Reference28 articles.

1. G. Harman, Wire Bonding in Microelectronics, 3rd ed. (New York: McGraw-Hill, 2010).

2. H. Liu, N. Fank, and C. Acosta, Int. J. Microcircuits Electron. Packag. 22, 121 (1999).

3. J. Goehre, U. Geissler, M. Schneider-Ramelow, and K. Lang, 7th International Conference on Integrated Power Electronics Systems (CIPS) (Berlin-Offenbach: VDE-Verlag, 2012), paper 06.2.

4. P. Agyakwa, M. Corfield, L. Yang, J. Li, V. Marques, and C. Johnson, Microelectron. Reliab. 51, 2 (2011). doi: 10.1016/j.microrel.2010.08.018 .

5. L. Merkle, T. Kaden, M. Sonner, and A. Gademann, 2nd Electronics System-Integration Technology Conference ESTC (2008). doi: 10.1109/ESTC.2008.4684554 .

Cited by 10 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A new insight into the synthesis mechanism of ScF3 by the NH4HF2 solid-phase fluorination method;Materials Today Communications;2024-08

2. Scandium in Commercial Wrought Aluminum Alloys;Rare Earth Metals and Minerals Industries;2023-12-29

3. Investigation of failure mechanism of aluminum-scandium wire bond contact under active power cycle test;Microelectronics Reliability;2023-05

4. Modern biotechnology and nanotechnology in competitive sports;Ferroelectrics;2021-07-04

5. Flow field analysis of rudder in CFD;PROCEEDINGS OF THE 14TH ASIA-PACIFIC PHYSICS CONFERENCE;2021