Solder Joint Reliability of Leadless Chip Carriers-Reference-Cited by-同舟云学术

Solder Joint Reliability of Leadless Chip Carriers

Published:1993 Issue: Volume: Page:579-606
ISSN:
Container-title:Thermal Stress and Strain in Microelectronics Packaging
language:
Short-container-title:

Author:

Lynch Jim,Boetti Alberto

Publisher

Springer US

Link

http://link.springer.com/content/pdf/10.1007/978-1-4684-7767-2_18.pdf

Reference20 articles.

1. Lynch, J. T., G. M. Brydon, M. R. Hepher, J. P. McCarthy, and A. Boetti, “Environmental Assessment of Ceramic Chip Carriers Solder-attached to Thick Film Alumina Substrates,” Proc. 32nd Electronic Components Conference, San Diego, 1982, p. 385.

2. ESA/SCC Generic Specification No. 9000 (Integrated Circuits, Monolithic).

3. Hong, J., and M. Chason, “Gold Removal from Component Terminations via Solder Dipping,” Proc. 39th Electronic Components Conference, Houston, 1989, p. 351.

4. Fukusawa, I., S. Ishiguro, and S. Nanbu, “Moisture Resistance Degradation of Plastic LSIs by Reflow Soldering,” Proc. International Reliability Physics Symposium, Orlando, 1985, p. 192.

5. Nishioka, T., M. Nagasawa, K. Igarashi, and M. Kohmoto, “Special Properties of Molding Compound for Surface Mounting Devices,” Proc. 40th Electronic Components and Technology Conference, Las Vegas, 1990, p. 625.

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Mechanical Evaluation in Electronics;Lead-Free Soldering in Electronics;2003-12-11

2. Microstructure evolution in Sn–Bi and Sn–Bi–Cu solder joints under thermal aging;Materials Chemistry and Physics;2001-09

3. No Clean Mass Reflow of Large Plastic Ball Grid Array Packages;Circuit World;1994-02

4. Mechanical Testing (For Electronics Applications);Structural Integrity and Reliability in Electronics