1. HD Solomon, Electronic Packaging: Materials and Processes, ASM, 1986, 22.
2. M Sakane, H Nose, M Kitano, H Takahashi, M Mukai and Y Tsukada, Dec, 2001, Tenth Int. Conf. on Fracture, ICF 10, Hawaii.
3. T A Siewert and C Handwerker, Test Procedures for Developing Solder Data, 2002, NIST, Special Publication 960–8.
4. For example, IPC-9701, Performance Test Methods and Qualification Requirements for Surface Mount Attachments, IPC, Jan, 2002.
5. O Unal, DJ Barnard and IE Anderson, Scripta Materialia, 1999, 40, 271.