Microstructure evolution in Sn–Bi and Sn–Bi–Cu solder joints under thermal aging
Author:
Publisher
Elsevier BV
Subject
Condensed Matter Physics,General Materials Science
Reference32 articles.
1. Lead (Pb)-free solders for electronic packaging
2. Microstructural evolution in Sn/Pb solder and Pb/Ag thick film conductor metallization
3. Intermetallic compound layer growth by solid state reactions between 58Bi-42Sn solder and copper
4. Progress in the design of new lead-free solder alloys
5. Investigation of multi-component lead-free solders
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