Thermal Cycling Aging Effects on Board-Level Drop Test Result
Author:
Publisher
Springer New York
Link
http://link.springer.com/content/pdf/10.1007/978-1-4614-0463-7_8
Reference16 articles.
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4. Chong DYR, Che FX, Pang JHL et al (2008) Evaluation on influencing factors of board-level drop reliability for chip scale packages (Fine-Pitch ball grid array). IEEE Trans Advanced Packaging 31(1):66–75
5. Chong DYR, Che FX, Pang JHL et al (2006) Drop impact reliability testing for lead-free and lead-based soldered IC packages. Microelectron Reliab 46(7):1160–1171
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